Wafer Cutting Machine


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Description

Cutting machine adopts PLC program control automation and goes well with cutting conveyors. Easy to change the cutters. The cutting layer is optional and adjustable. Cutting channel using organic glass shield as safety protection.

Material and parameter
Frame: GB steel
Food touch part:304 stainless steel
Motor:Germany SEW
Encoder:Germany Siemens
Switch: Germany Schneider
Power:0.75kw
Cutting style:wire cutting/knife cutting (optional)
Cutting speed:15 book/min

Dimension(L×W×H):1545×2100×1100 mm

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Inova International

Our mission is to enhance the quality of life and support the industry and nation by providing top-notch solutions, raw materials, machinery and ingredients for the Food & Beverage Industries. +88 02 48810564 / +88 01817 645087

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Inova International